Spatial perturbations in the solidifiaction process due to mold delaminations

The solidification process involving small periodical perturbations due to the system of mold delaminations is considered. Imperfections at the mold wall are modelled by non-ideal thermal contact conditions. It leads to the smali perturbation in the solid-liquid interface and in the temperature distribution in the solid phase. With the help of approximate technique, known as the heat-balance integral method, the problem is reduced to the sequence of ordinary differential equations in amplitudes of the Fourier series of the solidification front. The shape of solid-liquid interfaces is shown.